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Showing 1171 - 1180 of 12979 news items
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KnowBe4 Releases Q1 2025 Phishing Report, With Internal Communications Dominating
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Domain Name Industry News
on May 6, 2025
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Report reveals the most deceptive email subjects end users click, with internal communications driving 60% of phishing failures TAMPA BAY, Fla., April 28, 2025 /PRNewswire/ -- KnowBe4, the world-renowned cybersecurity platform that comprehensively addresses human risk management, today released its Q1 2025 Phishing Report . This quarter's findings reveal the most deceptive email subjects users click in phishing simulations, indicating HR and IT-r .. Read More
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ICANN DNS Forum in Hanoi: Leaders Convene to Shape the Multilingual Internet
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Domain Name Industry News
on May 6, 2025
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Fourth Asia Pacific DNS Forum runs from 8 to 9 May 2025 HANOI, Vietnam, April 28, 2025 /PRNewswire/ -- The Internet Corporation for Assigned Names and Numbers (ICANN) will hold the fourth Domain Name System (DNS) Forum in the Asia Pacific (APAC) region at the InterContinental Hanoi Landmark 72 in Hanoi, Viet Nam, from 8 to 9 May 2025 . ICANN is an international, nonprofit organization that coordinates the DNS and plays a key role in ensuring a gl .. Read More
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Zencoder Acquires Machinet to Further Strengthen AI Coding Ecosystem
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Domain Name Industry News
on May 2, 2025
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CAMPBELL, Calif., April 24, 2025 /PRNewswire/ -- Zencoder, a leading provider of AI agents integrated into developers' environments, today announced the acquisition of Machinet, a developer of context-aware AI coding assistants with more than 100,000 downloads in JetBrains IDE. This strategic acquisition further strengthens Zencoder's position in the rapidly growing AI coding assistant market and expands its multi-integration ecosystem .. Read More
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Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031 - Find Out Why | Valuates Reports
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Domain Name Industry News
on May 2, 2025
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BANGALORE, India, April 24, 2025 /PRNewswire/ -- Advanced Semiconductor Packaging Market is Segmented by Type (Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), 2.5D/3D), by Application (Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics). https://mma.prnewswire.com/media/1082232/Valuates_Reports_Logo.jpg The Advanced Semiconductor Packaging Market was valued a .. Read More
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