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Showing 31 - 40 of 30876 news items
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Fraimic to debut market first voice-to-art smart canvas prototypes at CES 2026
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Computer Hardware News
on Jan 22, 2026
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The app-free, cordless canvas displays AI-generated artwork from spoken ideas in vivid Spectra 6((TM)) E Ink and operates on multi-year battery life LAS VEGAS, Jan. 2, 2026 /PRNewswire/ -- Today, Fraimic announced that early prototypes of the Fraimic Smart Canvas--a voice-to-art, E Ink display system that AI-generates artwork from spoken prompts--will be shown publicly for the first time at CES in Las Vegas from January 6 - 9, 2025. Prototypes of .. Read More 
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Fescaro makes strong Kosdaq debut, eyes global auto cybersecurity
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Computer Hardware News
on Jan 22, 2026
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SUWON, South Korea, Dec. 19, 2025 /PRNewswire/ -- This is an article published in The Korea Herald: South Korean mobility software solutions provider Fescaro ( https://www.fescaro.com/en/ ) has made a successful debut on the Kosdaq market through the technology special listing track, accelerating its expansion in the global automotive cybersecurity market. The company's shares surged more than 70 percent on Dec. 10, their first day of trading. Fe .. Read More
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Guide Sensmart to Showcase Groundbreaking Apex Vision Technology at CES 2026
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Computer Hardware News
on Jan 22, 2026
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LAS VEGAS, Jan. 2, 2026 /PRNewswire/ -- Guide Sensmart, a pioneering innovator in consumer-grade thermal imaging, is set to make waves at Las Vegas, CES 2026. This year, Guide Sensmart will unveil its latest technology, ApexVision, a revolutionary thermal imaging technology platform that promises to redefine industry standards and reshape market expectations, alongside its core product lines focused on temperature measurement, outdoor hunting, se .. Read More
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F-713 - Successful 6-Axis Alignment System for PICs Upgraded with New Controller
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Computer Hardware News
on Jan 22, 2026
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PI's popular hexapod-based 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. SHREWSBURY, Mass., Dec. 17, 2025 /PRNewswire/ -- PI (Physik Instrumente) is pleased to announce the release of the F-713, the latest upgrade to its highly regarded F-712, 6-axis alignment system for photonics chips, fiber arrays, and wafers. The new model .. Read More
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ASSA ABLOY acquires Sargent and Greenleaf in the US
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Computer Hardware News
on Jan 22, 2026
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STOCKHOLM, Dec. 5, 2025 /PRNewswire/ -- ASSA ABLOY has acquired Sargent and Greenleaf, a US manufacturer of high-security mechanical and electronic locking solutions and safe hardware. "I am very pleased to welcome Sargent and Greenleaf to ASSA ABLOY. This acquisition delivers on our strategy to strengthen our position in mature markets through adding complementary products and solutions to our core business," says Nico Delvaux, President and CEO .. Read More
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Cyient Semiconductors Qualifies for Key Bid in Semi-Conductor Laboratory-Mohali Revamp
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Computer Hardware News
on Jan 22, 2026
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Company Set to Play a Key Role in Strengthening India's Custom Silicon Capabilities HYDERABAD, India, Dec. 5, 2025 /PRNewswire/ -- Cyient Semiconductors, a leader in custom ASIC turnkey and intelligent power solutions, announced that it has been qualified for a pivotal contract for the supply and qualification of technology IPs, including design enablement, for the ?4,500-crore modernization initiative at the Semi-Conductor Laboratory (SCL), Moha .. Read More
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