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Showing 6401 - 6410 of 30876 news items
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SlotsCalendar Successfully Launches In the U.S. Market
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Computer Hardware News
on Mar 27, 2024
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BUCHAREST, Romania, March 21, 2024 /PRNewswire/ -- In light of a continued initiative of providing comprehensive guidance in the iGaming landscape, SlotsCalendar announces the launch of its tailor-made platform for American users: https://www.slotscalendar.us . The brand's clear aim is to provide a digital environment where impartial and informative content is optimized specifically for the American market. https://mma.prnewswire.com/media/235122 .. Read More 
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AWE2024 Recap: Charting the Future of Smart Living
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Computer Hardware News
on Mar 27, 2024
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SHANGHAI, March 22, 2024 /PRNewswire/ -- AWE2024, concluded at Shanghai New International Expo Center on March 17, spanned four days and 150,000 m², attracting more than 1,000 global leaders in household appliances and consumer electronics industry. At AWE2024, Haier showcased HomeGPT, the first vertical model for its Smart Home Brain. Equipped with an extensive knowledge graph for smart home solutions, it provides more customized services. Hise .. Read More
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Global Hi-Tech Goods Industry Analysis - Emerging Segments such as IoT, AI, Robotics, Electric Vehicles, Battery, 3D Printing, Renewable Energy and Automation Reshuffle the Global Landscape
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Computer Hardware News
on Mar 27, 2024
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DUBLIN, March 22, 2024 /PRNewswire/ -- The "Global Overview of the Hi-Tech Goods Industry" report has been added to ResearchAndMarkets.com's offering. https://mma.prnewswire.com/media/539438/Research_and_Markets_Logo.jpg This briefing examines how the high-tech goods industry is performing globally and in the largest countries in terms of high-tech goods output. The report also provides data for production, market size, imports, ex .. Read More
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Semiconductor & IC packaging materials Market worth $70.9 billion by 2029 - Exclusive Report by MarketsandMarkets(TM)
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Computer Hardware News
on Mar 27, 2024
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CHICAGO, March 25, 2024 /PRNewswire/ -- The report " Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029" , is USD 43.9 billion in 2024 and is projected to reach USD 70.9 billion by 2029, at a CAGR of 10.1%. https://mma.prnewswire.com/media/22 .. Read More
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Mediavine Announces First Advancement in Privacy Sandbox Testing
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Computer Hardware News
on Mar 27, 2024
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Company Partners with OpenX to Conduct First Server-to-Server Integration NEW YORK, March 26, 2024 /PRNewswire/ -- Mediavine , the largest exclusive full-service ad management firm in the U.S., announced the first successful server-to-server integration in the Privacy Sandbox's Protected Audience API (PAAPI) since its launch earlier this year. Working with OpenX, one of the world's leading omnichannel supply-side platforms, Mediavine configured t .. Read More
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