|
Alphawave IP Announces Availability of Two New Interconnect IP Products in TSMC Advanced Processes
Tuesday, June 21, 2022
New products expand and extend Alphawave technology leadership in chiplets and optical solutions
LONDON and TORONTO, June 13, 2022 /PRNewswire/ - Alphawave IP (LN: AWE), a global leader in high-speed connectivity for the world's technology infrastructure, is pleased to announce availability of two new Interconnect IP's to their product portfolio. AresCORE16 is a Die-to-Die parallel interface that further extends Alphawave's chiplet leadership by enabling a new generation of chiplet products. OptiCORE100 is a 112Gbps PAM4 optical Serialiser-Deserialiser ("SerDes") that enables direct drive of optics and includes advanced DSP techniques for receiving optical waveforms.
Tony Pialis, President and Chief Executive Officer of Alphawave stated, "The addition of AresCORE16 and OptiCORE100 bring very exciting new opportunities for Alphawave IP to continue to help our customers solve the increasingly complicated connectivity challenges. AresCORE16 Die-to-Die IP is a key connectivity technology that enables the future of 2.5D and 3D packaging for the emerging Chiplet market and supports new and emerging standards, such as uCIE, Bunch of Wires (BOW), Open-HBI, and others for Die-To-Die interfaces. OptiCORE100 solves the unique challenges of electrical to optical communications in marketing leading power, performance, and area. Optical and Chiplet interface IPs are critical to deliver next generation connectivity within our data centers."
Tony Chan Carusone, Chief Technology Officer of Alphawave stated, "All of our silicon IPs leverage the power of Digital Signal Processing (DSP), which makes high performance connectivity much more reliable at very high speeds like 224Gbps and beyond. We constantly push the barrier of performance, power and silicon area with our connectivity IPs, and by leveraging our advanced DSP architectures, we can deliver the maximum benefits to our customers on leading edge TSMC N7, N5, N4, and N3 processes."
Alphawave IP's portfolio of connectivity IPs, including PCIe Gen6, CXL 3.0 and 800G Ethernet PHYs, are available for licensing and delivery now on TSMC N12, N7, N6, N5, N4 and N3 processes. Alphawave IP's newest IP offerings, AresCORE16 and OptiCORE100 are available now for design starts on TSMC N5 and N4 processes.
About Alphawave IP
Faced with the exponential growth of data, Alphawave's technology services a critical need: enabling data to travel faster, more reliably and with higher performance at lower power. Alphawave is a global leader in high-speed connectivity for the world's technology infrastructure. Our IP solutions, therefore, meet the needs of global tier-one customers in data centers, compute, networking, AI, 5G, autonomous vehicles, and storage. Founded in Toronto, Canada in 2017, by an expert technical team with a proven track record in licensing semiconductor IP, our mission is to focus on the hardest-to-solve connectivity challenges. To find out more about Alphawave IP, visit: awaveip.com
Trademarks
All registered trademarks and other trademarks belong to their respective owners.
View original content to download multimedia:https://www.prnewswire.com/news-releases/alphawave-ip-announces-availability-of-two-new-interconnect-ip-products-in-tsmc-advanced-processes-301566118.html
SOURCE Alphawave IP Group Plc
|
|
|
|
|
 |
Energy Toolbase Launches Energy Storage Partnership with Sungrow to Support PowerStack 255CS and PowerTitan 2.0 | Jan 22, 2026
|
 |
Einride and IonQ Partnership Uses Quantum Computing to Optimize the Logistics of Electric and Autonomous Freight | Jan 22, 2026
|
 |
RS now offers Phoenix Contact's pioneering new NearFi technology | Jan 22, 2026
|
 |
MetaOptics to Showcase Five Breakthrough Metalens-Powered Products at CES 2026 | Jan 22, 2026
|
 |
SCAILIUM Debuts "AI Production Layer" to Overcome GPU Starvation and Slash AI Energy Waste | Jan 22, 2026
|
 |
No Assembly Required: Barrett Distribution Centers Powers Maxwood Furniture's West Coast DTC Expansion | Jan 22, 2026
|
 |
Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing | Jan 22, 2026
|
 |
TESSAN to Redefine Global Mobility at CES 2026 with '100 Travelers' Initiative and Flagship Voyager 205 | Jan 22, 2026
|
 |
Hesai Recognized as the Only Lidar Company on Morgan Stanley's "Humanoid Tech 25" of Global Robotics Leaders | Jan 22, 2026
|
 |
AGS Devices Goes Live With CELUS Design Platform to Support Faster Electronics Design | Jan 22, 2026
|
|
|
|