Comprehensive Analysis Samsung Electronics' CDU50 System
Wednesday, August 3, 2022
DUBLIN, July 26, 2022 /PRNewswire/ -- The "Samsung Electronics Co., Ltd. 5G NR Digital BBU CDU50" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.
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This report provides a comprehensive analysis for the Samsung Electronics CDU50 system. This product is a 5G NR digital baseband unit and supports the distributed unit (DU) and centralized unit (CU) functions of a 5G NR gNodeB.
Features
-- System Functional Description
-- System Level Block Diagrams
-- High Level Mechanical Analysis
-- Heat Sink
-- Heat Fins
-- High Level PCB Analysis
-- Component Diagrams
-- Semiconductor/component locations on PCB
-- High Level Bill of Materials
-- Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
-- Complete Part Number/Marking
-- Component Manufacturer Identification
-- Function Component Description
-- Package Type
-- Excludes analysis of passive chip resistors, capacitors and inductors
Key Topics Covered:
EXECUTIVE SUMMARY
-- Active/Passive Component Summary
-- Important Note
CHAPTER 1: SAMSUNG 5G CDU
-- Overview of Baseband Unit
CHAPTER 2: MECHANICAL ANALYSIS
-- Chassis Frame (SHELF)
-- Chassis Frame Back Cover
-- Air Filter Unit
-- DC Power Busbar Unit
CHAPTER 3: FAN UNIT
-- Individual Fan Unit
CHAPTER 4: POWER/SIGNAL BACKPLANE DISTRIBUTION PCB (UCDB)
CHAPTER 5: GMA1-A1A MANAGEMENT CARD
-- Plastic Shield
-- Front Panel
-- GMA1-A1A PCB
-- GMA1-A1A PCB Top Active Component Analysis
-- GMA1-A1A PCB Top Passive Component Analysis
-- GMA1-A1A PCB Bottom Active Component Analysis
-- GMA1-A1A PCB Bottom Passive Component Analysis
CHAPTER 6: GCB1-C1A CHANNEL MODEM PCB
-- GCB1-C1A Plastic Shield
-- Front Panel
-- GCB1-C1A PCB
-- GCB1-C1A PCB Top Active Component Analysis
-- GCB1-C1A PCB Top Passive Component Analysis
-- GCB1-C1A PCB Bottom Active Component Analysis
-- GCB1-C1A PCB Bottom Passive Component Analysis
CHAPTER 7: GMA1-A1A IC HEAT SINKS
CHAPTER 8: GCB1-C1A IC HEAT SINKS
APPENDIX A COMPONENT ANALYSIS
APPENDIX B COMPONENTS BY SYSTEM AREA
APPENDIX C ACTIVE COMPONENTS BY SUPPLIER
APPENDIX D PASSIVE COMPONENTS BY SUPPLIER
For more information about this report visit https://www.researchandmarkets.com/r/xdg4rj
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View original content:https://www.prnewswire.com/news-releases/comprehensive-analysis-samsung-electronics-cdu50-system-301593586.html
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