Ansys Joins TSMC's OIP Cloud Alliance for Secure Multiphysics Analysis in the Cloud
Thursday, May 4, 2023
TSMC and Ansys are partnering to enable Ansys multiphysics analysis tools to work easily together with data security across major cloud providers
/ Key Highlights
-- Ansys tools and flows are designed natively for the cloud
-- Mutual customers will benefit from faster run times and elastic
computing with major cloud vendors
PITTSBURGH, April 26, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) announced that it has joined TSMC's OIP Cloud Alliance to facilitate the deployment of fully distributed workflows for mutual customers. By driving toward the cloud interoperability of Ansys multiphysics solutions with TSMC's technology enablement, customers will easily be able to gain the full benefits of faster run times and elastic computing with major cloud vendors.
Combining EDA parallelism and cloud scalability, TSMC and its OIP Cloud Alliance partners are creating next-generation, cloud-optimized design methodologies to further accelerate turnaround time of critical design tasks. Ansys and other EDA partners will optimize their tools for multi-threaded, fully-distributed runs to best utilize cloud, while cloud partners will bring new virtual machines most suitable for the EDA workload of IC designs.
"Our customers of all sizes are leveraging the cloud to boost productivity while designing in TSMC's leading-edge technologies for new applications from high performance computing to mobile, artificial intelligence, networking, and 3D-IC," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "By welcoming Ansys as the latest member into our OIP Cloud Alliance, TSMC aims to make Ansys' leading multiphysics signoff solutions available to all of our customers and help them bring their differentiated products to market sooner, with higher quality."
Ansys was an early adopter of elastic cloud computing with its SeaScape big-data platform - a cloud-native data infrastructure that was designed specifically for EDA. Ansys® RedHawk-SC(TM) was the first tool built to work with SeaScape (SC) and many other Ansys semiconductor tools have followed, including Ansys® PathFinder-SC(TM), Ansys® Totem-SC(TM), and Ansys® PowerArtist-SC(TM).
"Ansys' strategy for the future foresees an absolutely central role for cloud computing," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "We have invested heavily in cloud-enabled platforms that give our products clear advantages in speed and capacity over traditional tool environments that were not designed for the cloud."
/ About Ansys
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
Take a leap of certainty ... with Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS-T
/ Contacts
Media
Mary Kate Joyce
724.820.4368
marykate.joyce@ansys.com
Investors
Kelsey DeBriyn
724.820.3927
kelsey.debriyn@ansys.com
View original content to download multimedia:https://www.prnewswire.com/news-releases/ansys-joins-tsmcs-oip-cloud-alliance-for-secure-multiphysics-analysis-in-the-cloud-301808183.html
SOURCE Ansys
|
|
|
|
|
 |
Energy Toolbase Launches Energy Storage Partnership with Sungrow to Support PowerStack 255CS and PowerTitan 2.0 | Jan 22, 2026
|
|
Einride and IonQ Partnership Uses Quantum Computing to Optimize the Logistics of Electric and Autonomous Freight | Jan 22, 2026
|
|
RS now offers Phoenix Contact's pioneering new NearFi technology | Jan 22, 2026
|
|
SCAILIUM Debuts "AI Production Layer" to Overcome GPU Starvation and Slash AI Energy Waste | Jan 22, 2026
|
|
MetaOptics to Showcase Five Breakthrough Metalens-Powered Products at CES 2026 | Jan 22, 2026
|
|
No Assembly Required: Barrett Distribution Centers Powers Maxwood Furniture's West Coast DTC Expansion | Jan 22, 2026
|
|
Hesai Recognized as the Only Lidar Company on Morgan Stanley's "Humanoid Tech 25" of Global Robotics Leaders | Jan 22, 2026
|
|
Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing | Jan 22, 2026
|
|
TESSAN to Redefine Global Mobility at CES 2026 with '100 Travelers' Initiative and Flagship Voyager 205 | Jan 22, 2026
|
|
1inch Named Exclusive Swap Provider at Launch for Ledger Multisig | Jan 22, 2026
|
|
|
