Global Semiconductor Advanced Packaging Strategic Business Report 2023 - Amkor Technology Leading Packaging Technology Innovation
Friday, December 8, 2023
DUBLIN, Nov. 30, 2023 /PRNewswire/ -- The "Semiconductor Advanced Packaging - Global Strategic Business Report" has been added to ResearchAndMarkets.com's offering.
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The global market for Semiconductor Advanced Packaging estimated at US$35.8 Billion in the year 2022, is projected to reach a revised size of US$68 Billion by 2030, growing at a CAGR of 8.3% over the analysis period 2022-2030.
Flip Chip Packaging, one of the segments analyzed in the report, is projected to record 7.9% CAGR and reach US$49.1 Billion by the end of the analysis period. Growth in the 2.5d/3d Packaging segment is estimated at 10.9% CAGR for the next 8-year period.
The U.S. Market is Estimated at $3.3 Billion, While China is Forecast to Grow at 9.8% CAGR
The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.3 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$19.9 Billion by the year 2030 trailing a CAGR of 9.8% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.9% and 6.8% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.1% CAGR.
Key Market Trends & Drivers
-- Digital Transformation Drive to Steer Future Growth of Advanced
Packaging Market
-- IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced
Packaging
-- New Packaging Technologies Crucial to Semiconductor Innovation
-- 3D Chip Stacking Technology to Drive Future Advanced Packaging
Technology
-- 3D InCites - Advanced Packaging for 5G
-- 2.5D Packaging Emerges as Powerful Option for Next-Generation AI
Products
-- Advanced Packaging Influences Design Chain
-- Led by Innovation, Semiconductor Advanced Packaging Enters into Exciting
Era
-- Innovative Advanced Packaging Techniques to Flood the Market
-- Amkor Technology Leading Packaging Technology Innovation
-- Reducing the Cost of Advanced Packaging
-- Investments in Advanced Packaging: A Critical Component for Resilient
Semiconductor Supply Chain
-- Trends in Consumer Electronics Sector Influence the Semiconductor
Advanced Packaging Market
-- Post Pandemic Recovery in CE Sector to Augment Prospects
-- Review of Key CE Products Driving Adoption of Semiconductor Advanced
Packaging Technology
-- FOWLP and Challenges to Packaging Materials Suppliers
-- Automobile Electronification Trends Widen the Addressable Market
-- Anticipated Post COVID Recovery to Revive Opportunities in Aerospace
Sector
-- Sustained High Growth in ICT Sector Augurs Well
-- Fan-Out Packaging: Promises & Key Challenges
-- Implications of Chiplets & Related Designs for Advanced Packaging
-- Solving Lithography Challenges
-- Semiconductor Supply Chain: The Complex Nature & Vulnerabilities
-- Vulnerabilities for WBG Power Semiconductors
Select Competitors Featured in the Report
-- Advanced Micro Devices
-- Applied Materials
-- Avery Dennison
-- Amkor Technology
-- Advantest
-- Brewer Science
-- American Semiconductor
-- ASM Pacific Technology
-- ASE Technology Holding.
-- AT & S Austria Technologie & Systemtechni
-- BE Semiconductor Industries
-- Amtech Microelectronics
-- APSTL
-- Boschman Technologies
-- ASE Korea
Key Topics Covered:
1. MARKET OVERVIEW
-- Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope
for Industries Reliant on Consumer Discretionary Incomes: Global Number
of Unemployed People (In Million) for Years 2019, 2020, 2021, and 2022
-- Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of
Value Chain Modularity
-- Among the Hammered Companies in the Supply Chain is the "Semiconductor
Industry"
-- Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms
of Disruption & Time to Recovery (In Months) as of May 2020
-- Supply Chain Disruptions Impact a Large Number of Electronic
Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due
to COVID-19 Worldwide as of May 2020
-- Semiconductor Trends for Specific End-Use Categories
-- COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor
Leaders Secure New Lease of Life
-- Falling Consumer Confidence Impacts Sales of Automotive and Consumer
Electronics
-- Industrial Activity Remain Subdued in 2020
-- Global PMI Index Points for the Years 2018, 2019 & 2020
-- Competitive Scenario
-- Semiconductor Supply Chain Transitions at Various Levels
-- Financial Performances of Packaging Suppliers Reveals New Growth Players
-- Unconventional Players Joining Semiconductor Advanced Packaging
Bandwagon
-- Semiconductor Advanced Packaging - Global Key Competitors Percentage
Market Share in 2022 (E)
-- Semiconductor Advanced Packaging Competitor Market Share Scenario
Worldwide (in %): 2020E
-- Competitive Market Presence - Strong/Active/Niche/Trivial for Players
Worldwide in 2022 (E)
-- Flip Chip Packaging (Technology) Global Competitor Market Share
Positioning for 2020 & 2027
-- 2.5D/3D Packaging (Technology) Market Share Breakdown of Key Players:
2020 & 2027
-- FI WLP (Technology) Competitor Revenue Share (in %): 2020 & 2027
-- FO WLP (Technology) Market Share Shift by Company: 2020 & 2027
-- Rising Semiconductor Demand Presents Bundle of Joy for Advanced
Packaging Market
-- Prominent Factors Stirring Semiconductor Advanced Packaging Market
-- Global Market Prospects & Outlook
-- Flip-Chip: Key Contributing Segment
-- Rising Investments to Benefit Market
-- Key Trends to Drive Semiconductor Advanced Packaging Market
-- Regional Analysis
-- An Introduction to Semiconductor Advanced Packaging
-- Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
For more information about this report visit https://www.researchandmarkets.com/r/2kw5c
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