NEO Semiconductor Reveals a Performance Boosting Floating Body Cell Mechanism for 3D X-DRAM during IEEE IMW 2024 in Seoul, Republic of Korea
Tuesday, May 21, 2024
Innovative mechanism aims to increase data retention by 40,000X and sensing window by 20X
SAN JOSE, Calif., May 13, 2024 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced a performance boosting Floating Body Cell Mechanism for 3D X-DRAM. Andy Hsu, Founder & CEO presented groundbreaking Technology CAD (TCAD) simulation results for NEO's 3D X-DRAM(TM) during the 16(th) IEEE International Memory Workshop (IMW) 2024 in Seoul, Republic of Korea.
Neo Semiconductor reveals a unique performance boosting mechanism called Back-gate Channel-depth Modulation (BCM) for Floating Body Cell that can increase data retention by 40,000X and sensing window by 20X.
"Unlike the traditional 2D Floating Body Cell that uses body effect to change the cell current, our BCM mechanism employs a back-gate voltage to modulate the channel depth. This patented invention increases the sensing window and data retention significantly, that will result in faster and more reliable DRAM, and reduce the refresh frequency to save power," said Andy Hsu, Founder & CEO of NEO Semiconductor. "We are proud to lead the DRAM industry into the 3D era while solving the capacity scaling bottleneck that the current 2D DRAM is experiencing".
NEO Semiconductor's 3D X-DRAM(TM) is a first-of-its-kind 3D NAND-like DRAM cell array structure based on floating body cell technology. It can be manufactured using today's mature 3D NAND-like process. Based on Neo's estimates, 3D X-DRAM(TM) technology can achieve 128 Gb density with 300 layers, which is 8 times today's DRAM density. It can also reduce the chip's footprint and power consumption.
About NEO Semiconductor
NEO Semiconductor is a high-tech company focused on advancing 3D NAND flash and DRAM technologies. The company was founded in 2012 by Andy Hsu and a team in San Jose, California, and owns more than 24 U.S. patents. In 2020, the company made a breakthrough in 3D NAND architecture named X-NAND(TM) that can achieve SLC performance from TLC and QLC memory to provide high-speed, low-cost solutions for many applications, including 5G and AI. In 2022, the company launched its X-DRAM(TM) technology, representing a new architecture that can deliver DRAM with the world's lowest power consumption. In 2023, NEO launched its ground-breaking 3D X-DRAM(TM) technology, a game changer in the memory industry, enabling the world's first 3D NAND-like DRAM to solve capacity scaling bottlenecks and move the market past the limitations of 2D DRAM. For more information, visit https://neosemic.com/.
Media and Analyst Contact:
Maya Lustig
mayalustig@neosemic.com
Photo - https://mma.prnewswire.com/media/2410478/Neo3d_Slide.jpg
Logo - https://mma.prnewswire.com/media/2068694/NEO_Semiconductor_Logo.jpg
View original content to download multimedia:https://www.prnewswire.com/news-releases/neo-semiconductor-reveals-a-performance-boosting-floating-body-cell-mechanism-for-3d-x-dram-during-ieee-imw-2024-in-seoul-republic-of-korea-302143383.html
SOURCE NEO Semiconductor
|
|
|
|
|
 |
Energy Toolbase Launches Energy Storage Partnership with Sungrow to Support PowerStack 255CS and PowerTitan 2.0 | Jan 22, 2026
|
|
RS now offers Phoenix Contact's pioneering new NearFi technology | Jan 22, 2026
|
|
Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing | Jan 22, 2026
|
|
MetaOptics to Showcase Five Breakthrough Metalens-Powered Products at CES 2026 | Jan 22, 2026
|
|
Fresco Raises EUR15m Series C to Power the Future of AI-Driven Cooking and the Connected Kitchen Ecosystem | Jan 22, 2026
|
|
Einride and IonQ Partnership Uses Quantum Computing to Optimize the Logistics of Electric and Autonomous Freight | Jan 22, 2026
|
|
No Assembly Required: Barrett Distribution Centers Powers Maxwood Furniture's West Coast DTC Expansion | Jan 22, 2026
|
|
SCAILIUM Debuts "AI Production Layer" to Overcome GPU Starvation and Slash AI Energy Waste | Jan 22, 2026
|
|
Hesai Recognized as the Only Lidar Company on Morgan Stanley's "Humanoid Tech 25" of Global Robotics Leaders | Jan 22, 2026
|
|
Ekinops New C700HC Chassis Efficiently Connects the Data Center and the Central Office | Jan 22, 2026
|
|
|
