Axcelis Announces Participation in SEMICON Japan 2024
Wednesday, December 11, 2024
BEVERLY, Mass., Dec. 3, 2024 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will showcase its Purion(TM) and GSD Ovation(TM) Series of ion implanters at the SEMICON Japan 2024 exhibition. The conference and exhibition are being held December 11-13, at the Tokyo Big Sight in Tokyo, Japan. Axcelis will be in Hall 4, Booth #4621.
Semiconductor manufacturers are invited to visit the Axcelis exhibit to learn first-hand about innovative ion implant solutions that deliver significant technology and manufacturing advantages.
-- Purion Power Series(TM) - Featuring Axcelis' innovative solution for
thin silicon, TAIKO and silicon carbide (SiC) wafer processing across
the full power device applications space, and wafer handling capable for
150mm, 200mm and 300mm wafers.
-- Purion H(TM) Series - Offering unmatched purity and precision while
achieving industry leading productivity across the full high current
operating space.
-- Purion H200(TM) - Axcelis' state of the art single wafer high current
medium energy implanter designed to address the unique implant needs for
devices designed for the Internet of Things (IoT) and power
applications.
-- Purion XE(TM) Series - The industry leading high energy implant platform
with the widest energy range, including the Purion XEmax model featuring
patented Boost Technology(TM) for the most advanced image sensor
applications up to 15MeV.
-- Purion M(TM) Series - The lowest power consumption medium current
implanter offering the broadest range of mid-current doses available,
and unparalleled flexibility to meet today's evolving implant
requirements.
-- GSD Ovation(TM) - Providing the most cost-effective way to extend high
current and high energy batch platform capability by supporting emerging
applications in wafer splitting (Si and SiC) and alternate substrates
(lithium tantalate and ceramic).
During the show, Axcelis will also host the following events on Thursday, Dec. 12th:
-- SiC Power Device Manufacturing Ion Implant TechnologyExhibitor's
TechSPOT Hall 5, 15:30 - 15:50 p.m.The power device market is at a
critical inflection point as chipmakers transition from 150mm to 200mm
SiC wafers. Ion implant equipment needs to offer the flexibility to
handle multiple wafer sizes, various substrate types and operate at
various implant temperatures. Please join us to learn about Axcelis'
Silicon & Silicon Carbide (SiC) power semiconductor product line, SiC
implant Al ion sources and productivity options and Si IGBT wafer
handling and proton (H+) implant solutions.
-- Axcelis Happy Hour CelebrationHall 4 Booth #4261, 16:00 - 17:00 p.m.Join
us for beverages and appetizers and meet the Axcelis team!
President and CEO of Axcelis Technologies Russell Low, said, "We're excited to be a part of this important market and the opportunity to provide the most advanced ion implant technology to Japan chipmakers. We are proud of our growing installed base and support infrastructure in Japan and remain focused on expanding our market share by providing customers the most innovative, enabling implant technology and support solutions to ensure their success."
Charles Pieczulewski, Axcelis Country Manager, Japan, commented, "Japan customers continue to be impressed by Axcelis' broad implant product portfolio for power, image sensor, memory and logic applications. We look forward to displaying our newest technological advancements at SEMICON Japan."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.
AXCELIS CONTACTS:
Japan:
Charles Pieczulewski (Country Manager, Japan) +81.3.5860.2586
Global:
Maureen Hart (Editorial/Media) +1.978.787.4266
David Ryzhik (Investor Relations) +1.978.787.2352
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SOURCE Axcelis Technologies, Inc.
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