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Ansys 2025 R1 Increases Collaboration, Expands Cloud and AI Functionality, and Delivers Data-Driven Insights with Powerful Digital Engineering Technology
Wednesday, February 12, 2025
Digital engineering-enabling technologies connect parallel workstreams, reducing costly prototyping, facilitating cross-functional collaboration, and accelerating time-to-market
/ Key Highlights
-- The Ansys SimAI(TM) cloud-enabled artificial intelligence solution now
allows users to expand the training data to gain further insight during
post-processing
-- New capabilities in the Ansys System Architecture Modeler (SAM)(TM)
include support for SysML v2, enabling more optimized product designs
and significant time savings by creating tighter connections across
teams while making product requirements accessible and scalable across
the engineering organization
-- CFD HPC Ultimate is a new product that enables enterprise-level
computational fluid dynamics (CFD) capabilities for one job on multiple
CPU cores or GPUs -- without the need for additional high-performance
computing (HPC) licenses
PITTSBURGH, Feb. 4, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) 2025 R1 features refined digital engineering-enabling technologies that easily integrate with existing infrastructure, minimizing disruption and empowering teams to collaborate on more innovative products. Supercharged by the power of AI, cloud computing, GPUs, and HPC, Ansys R1 enhancements enable faster, collaborative decision-making, broader design exploration, and reduced product design timelines.
"Ansys 2025 R1 offers more integration capabilities than ever, helping teams carve a digital path through the entire lifecycle of a product, with tools and solutions to help expertly manage data pre- and post-development," said Shane Emswiler, senior vice president of products at Ansys. "This release highlights that our solutions can serve as guideposts, helping disconnected teams stay the course and work collaboratively from a single, accessible source of truth. This not only significantly cuts costs, but it also accelerates time-to-market, which helps our customers stay competitive."
As products become more integrated and complex, R&D processes must adapt to meet growing and ever-changing market demands. Ansys meets customers where they are in their digital transformation journey and equips them with tools and solutions to meet evolving market needs.
Advanced physics solvers
Ensuring product performance begins with understanding the multiphysics involved, from the components to the system. The latest release from Ansys highlights new products and capabilities that deliver fast, high-fidelity, physics-based results, helping teams make informed decisions earlier in the design cycle:
-- Ansys Discovery(TM) 3D simulation software significantly expands thermal
modeling with the addition of electrothermal analysis, orthotropic
conductivity, and internal fans while maintaining speed and ease of use
-- The structural analysis suite features a fully integrated solution for
noise, vibration, harshness (NVH), delivering 10x faster frequency
response function (FRF) calculator, vibro-acoustics mapping, optimized
meshing, and mode contribution analysis
-- Ansys Electronics connects to other Ansys software products, enabling
improved meshing that is crucial for 3D integrated circuits, automated
workflow capabilities, and boosted simulation performance
-- A new Polymer FEM product utilizes high-fidelity models to capture
real-world materials behavior, addressing customers' evolving materials
simulation requirements
"The Ansys platform offers key advantages for Firefly as we rapidly innovate to support responsive space services," said Brigette Oakes, vice president of engineering at Firefly Aerospace. "CFD is one area where Ansys shines -- Fluent accurately models combustion dynamics and complex thermal interactions in our engine designs. Its integration of thermal and structural analysis simplifies workflows, and its user-friendly interface and responsive support team make it a critical tool for a fast-paced company like ours."
Cloud, HPC, and GPUs
The power of cloud computing, HPC, and GPUs are changing the speed at which modern products are engineered. Accessibility, interoperability, and scalability are the heart of this evolution, empowering customers to go beyond the limits of desktop applications to collaboratively design more innovative products. Ansys R1 highlights advancements to its GPU solvers and adds web-based, on-demand capabilities to a variety of applications:
-- The Ansys Fluent(®) multi-GPU fluid simulation solver now supports
applications with very high total mesh cell counts, such as automotive
external aerodynamics. This allows designers to add more parameters to
refine accuracy without compromising overall simulation speed
-- Ansys CFD HPC Ultimate is a new product that enables enterprise-level
CFD capabilities for one job on multiple CPU cores or GPUs without the
need for additional HPC licenses
-- New GPU-accelerated simulations in Ansys Lumerical FDTD(TM) advanced 3D
electromagnetic simulation software uses 50% less GPU memory and
provides a 20% reduction in meshing time compared to CPUs
-- The Ansys Mechanical(TM) GPU-accelerated direct structural finite
element analysis solver is up to 6x faster than alternative solutions
and the iterative solver is 6x faster than CPU-only versions
-- Ansys Cloud Burst Compute with Discovery empowers designers to solve
1,000 design variations in 10 minutes. Parametric studies in Discovery
are accelerated by 100x or more by leveraging NVIDIA GPUs
-- The Ansys Cloud Burst Compute capability provides elastic, flexible,
on-demand HPC capacity for Ansys Mechanical, Fluent, and Ansys HFSS(TM)
high-frequency electromagnetic simulation software
Artificial intelligence
Ansys continues to deepen its portfolio with AI-augmented technologies, bringing unparalleled speed, innovation, and accessibility to the computer-aided engineering (CAE) industry. Ansys AI allows teams to use new or previously generated data to analyze designs within minutes, rapidly train their own AI models, speed time-to-market, and reduce costs:
-- Ansys has developed an intuitive, interactive tool to streamline data
preparation for SimAI modeling
-- SimAI now allows users to expand the training data to gain further
insight during post-processing, such as honing analysis around a
specific component within a larger design
-- Ansys Electronics AI+ uses AI-driven techniques to predict resources and
runtime for electronics simulations in Ansys Maxwell(®) advanced
electromagnetic field solver, Ansys Icepak(®) electronics cooling
simulation software, and HFSS
-- Advanced synthetic radar simulation within Ansys RF Channel Modeler(TM)
high-fidelity wireless channel modeling software empowers the digital
mission engineering community with a comprehensive training and
validation dataset for ground-based AI target identification
"Ansys' industry-leading simulation solutions will help drive Vertiv's business model as we design solutions for the future," said Steve Blackwell, vice president of engineering at Vertiv. "Our mission is to revolutionize the way the world conceptualizes and develops data centers -- from cooling and power technologies through implementing AI in the design of the data center itself. With Ansys, we will more quickly meet critical milestones that will help us deliver the most optimal infrastructure to support our customers' AI-based projects with energy-efficient and reliable future-forward designs."
Connected ecosystem
Cutting-edge R&D involves adopting design methodologies like model-based systems engineering (MBSE) and automation to keep workflows seamless and efficient. Ansys solutions are interoperable and scalable, making it easy to integrate new technologies into existing infrastructure to avoid product design disruption. Included in the Ansys 2025 R1 are enhancements that focus on MBSE capabilities and data management to make the digital transition easier:
-- Ansys ModelCenter(®) MBSE software and SAM deliver upgraded support for
SysML v2, allowing more optimized product designs and significant time
savings by creating tighter connections across teams while making
product requirements accessible and scalable across the engineering
organization
-- ModelCenter now has improved MBSE connectivity for greater
compatibility, including an enhanced Capella connector and deeper
integration with Ansys SAM for intuitive search, save, and modification
-- Ansys Minerva(®) simulation process and data management software
generic connector improvements help reduce the time and cost of
implementation by standardizing how external data is brought into
Minerva, allowing users to verify and resolve any conflicts before
uploading. The connector also helps improve engineer productivity with
new asynchronous job launch capabilities
Additional R1 announcements include:
-- Ansys optiSLang(®) process integration and design optimization software
includes enhancements across interfaces, distributed computing, and more
advanced algorithms, adding flexibility and performance to the design
workflow
-- Ansys Granta Materials Intelligence (MI)(®) product collection's
integrations with CAE, computer-aided design, and product lifecycle
management software now feature a unified user experience between the
Granta end-user interface and the integration interfaces
-- Task-based performance improvements made to the fault tolerant meshing
and watertight meshing workflows in Fluent improve meshing speeds
-- Ansys PowerX(TM), a new tool for power field-effect transistor (FET) and
power management integrated circuit (PMIC) analysis, simulation, and
optimization
Click here to learn more about Ansys 2025 R1.
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement(TM)
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
ANSS-T
/ Contacts
Media
Mary Kate Joyce
724.820.4368
marykate.joyce@ansys.com
Investors
Kelsey DeBriyn
724.820.3927
kelsey.debriyn@ansys.com
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