MediaTek Dimensity 7400 and Dimensity 6400 Makes Improved Gaming, Connectivity and AI Performance More Accessible
Tuesday, March 4, 2025
Latest power-efficient chipsets complement full Dimensity portfolio of best-in-class mobile SoCs
HSINCHU, Feb. 24, 2025 /PRNewswire/ -- MediaTek announced a trio of new ultra-efficient chipsets designed to be an integral part of the industry-leading MediaTek Dimensity family, offering exceptional experiences for high-tech and mainstream mobile devices to complement the flagship and premium offerings of the Dimensity 9400 and 8400. The Dimensity 7400 and 7400X are geared to deliver advanced gaming and AI camera technology to consumers, and the Dimensity 6400 provides fantastic performance and enhanced 5G in an accessible package.
Both Dimensity 7400 chipsets integrate an octa-core CPU with 4X Arm Cortex-A78 cores operating up to 2.6GHz and 4X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G615 MC2 GPU. Built on TSMC's 4nm process node, the Dimensity 7400 and 7400X run super efficiently, using between 14% to 36% less power when gaming compared to competitive chipsets. In addition, the SoCs feature MediaTek Advanced Gaming Technology (MAGT) 3.0 support for improved graphics performance, AI optimizations that adjust game settings based on the device's workload, reduced input lag for quicker response, and advanced power savings so users can enjoy longer gaming sessions.
"With our Dimensity 7400 and Dimensity 6400 chipsets, MediaTek is proving once again that it has the capability to bring incredible smartphone experience to more affordable price ranges," said Dr. Yenchi Lee, General Manager of MediaTek's Wireless Communications Business. "Whether gaming, using the latest AI applications, or taking photos and videos, users can enjoy the significant performance and impressive energy efficiency that they have come to expect from the Dimensity family."
To boost the performance of AI applications, Dimensity 7400 and Dimensity 7400X integrate MediaTek's NPU 6.0, with a 15% upgrade in performance over the Dimensity 7300. Offering premium multimedia capabilities with an Imagiq 950 high-end signal processor (ISP), Dimensity 7400 and 7400X support advanced AI camera features for capturing stunning images, even in low lighting. The chips also have Google Ultra HDR support for higher dynamic range, vivid colors, and better contrast for photos and videos. This ensures that photos and videos retain their quality when uploading from a user's smartphone to social media.
Additional features of the Dimensity 7400 and Dimensity 7400X include:
-- Support for dual display flip phones (7400X) to give OEMs more design
flexibility.
-- 5G R16 modem with 3CC carrier aggregation (3CC-CA) that leverages
MediaTek's UltraSave 3.0+ technologies to provide 20% lower power
compared to the competition.
-- Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless
connectivity.
MediaTek Dimensity 6400
The newest entry in the Dimensity 6000 series of affordable chipsets enhances the latest 5G connectivity features to make them accessible to more people around the world. The Dimensity 6400 utilizes an octa-core CPU with 2X Arm Cortex-A76 cores operating up to 2.5GHz and 6X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G57 MC2 GPU. Built on TSMC's 6nm process node, Dimensity 6400 runs super efficiently, using up to 19% less power when gaming compared to competitive chipsets.
Key features of the chipset include:
-- MediaTek Bluetooth Wi-Fi HyperCoex Technology which reduces gaming
latency by up to 90% for a smoother gaming experience.
-- Release 16 Sub-6 5G Modem supports 2CC-CA for improved connectivity.
-- Up to 33% faster downlink and 18% faster uplink speeds compared to
competitors.
-- Enables billion-color displays with real 10-bit images and videos for
vivid visuals and supports True Color Accuracy for improved color
correction, generating more accurate and lifelike visuals.
-- 108MP camera sensors enhanced with MediaTek and Arcsoft's multi-frame
noise reduction (MFNR) and low pass noise reduction (LPNR) for sharper
selfies and portraits.
The first smartphones powered by the MediaTek Dimensity 7400 and 7400X will be available in Q1 2025; Dimensity 6400 is currently available. To learn more about MediaTek's Dimensity portfolio, please visit: https://i.mediatek.com/mediatek-5g.
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About MediaTek Inc.
MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.
Contact Information:
Kevin Keating
pr@mediatek.com
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SOURCE MediaTek Inc.
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