SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation
Thursday, September 4, 2025
-- Company first in industry to develop High-K EMC material, improves
thermal conductivity by 3.5 times, thermal resistance by 47%
-- Customers expect achievement to help address heat issue generated from
on-device AI
-- SK hynix to lead next-generation DRAM for mobile device through
technological innovation of materials
SEOUL, South Korea, Aug. 27, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has started supplying mobile DRAM products with highly efficient heat dissipation by adopting the High-K Epoxy Molding Compound* material for the first time in the industry.
* EMC(Epoxy Molding Compound): a critical material for semiconductor packaging that protects chips from various external conditions such as water, heat, impact and electronic charge and provides a channel where heat can be dissipated. High-K EMC raises thermal conductivity with adoption of a material with high heat-
transfer coefficient in EMC
The development comes as heat generated in the process of fast data transfer for on-device AI applications results in performance degradation of smartphones. Global smartphone companies welcome the launch of the product on expectations that it will help address the heat issue of high-performance flagship smartphones.
The structure of package on package, or PoP**, that most flagship smartphones adopt and stacks DRAM onto the application processor***, allows efficient use of limited space, while improving data transfer speed. Such system, however, also triggers a performance degradation of the device itself as heat generated within the mobile AP stays inside DRAM.
** PoP(Package on Package): a packaging method commonly used for mobile products. Different types of chips are stacked vertically to improve space efficiency, performance and flexibility of combinations
*** Mobile AP(Application Processor): chip referred to the brain of mobile devices such as smartphones and tablets
SK hynix found the solution in improvement of thermal conductivity of EMC, a critical material that covers DRAM package and developed High-K EMC by adding Alumina to Silica, which has been adopted for EMC material so far.
With thermal conductivity improved by 3.5 times and thermal resistance in the vertical course of the heat improved by 47%, the new technology is expected to contribute to a longer battery runtime and product lifespan by improving performance of a smartphone and reducing power consumption.
"It's a meaningful achievement that goes beyond a simple performance improvement as it addresses the inconvenience that many high-performance smartphone users may have had," Lee Gyujei, Head of Package Product Development, said. "We are committed to firmly establishing our technological leadership in the next-generation mobile DRAM market with our technological innovation in materials."
About SK hynix Inc.
SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.
View original content:https://www.prnewswire.com/news-releases/sk-hynix-starts-supplying-mobile-dram-with-highly-efficient-heat-dissipation-302540062.html
SOURCE SK hynix Inc.
|
|
|
|
|
 |
Energy Toolbase Launches Energy Storage Partnership with Sungrow to Support PowerStack 255CS and PowerTitan 2.0 | Jan 22, 2026
|
|
No Assembly Required: Barrett Distribution Centers Powers Maxwood Furniture's West Coast DTC Expansion | Jan 22, 2026
|
|
RS now offers Phoenix Contact's pioneering new NearFi technology | Jan 22, 2026
|
|
Hesai Recognized as the Only Lidar Company on Morgan Stanley's "Humanoid Tech 25" of Global Robotics Leaders | Jan 22, 2026
|
|
MetaOptics to Showcase Five Breakthrough Metalens-Powered Products at CES 2026 | Jan 22, 2026
|
|
Lumana Surpasses 50,000 Cameras, Cementing Its Leadership in AI Video Surveillance | Jan 22, 2026
|
|
VQ Capital Launches an AI-Driven Platform Engineered for the Next Generation of Investments | Jan 22, 2026
|
|
SCAILIUM Debuts "AI Production Layer" to Overcome GPU Starvation and Slash AI Energy Waste | Jan 22, 2026
|
|
Daikin Applied Invests $163M in Advanced R&D Test Lab to Bolster HVAC Innovation for Data Centers and Beyond | Jan 22, 2026
|
|
Secure the Limited Time Offered 2025-2026 ezPaycheck Bundle! | Jan 22, 2026
|
|
|
