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Investor Insight: HBM Market Poised for 26.10% CAGR, Reaching USD 22.57 Billion by 2034 | DataM Intelligence
Saturday, September 20, 2025

AUSTIN, Texas and TOKYO, Sept. 12, 2025 /PRNewswire/ -- The High-Bandwidth Memory (HBM) Market Size reached US$ 2.90 billion in 2024 and is expected to grow to US$ 15.67 billion by 2032, expanding at a CAGR of 23.63% during 2025-2032. Growth is being propelled by the exponential rise in AI workloads, high-performance computing (HPC), data center deployments, and advanced graphics that demand ultra-fast, energy-efficient memory.

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Unlike conventional DRAM, HBM uses a 3D-stacked design with through-silicon vias (TSVs), enabling up to 8-10x higher bandwidth per watt. This has made it indispensable for AI accelerators, GPUs, and next-gen supercomputers, where training large language models can involve trillions of parameters and petabytes of data.

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Strategic Developments and Industry Initiatives:

    --  SK hynix: Market Leadership and HBM3E RolloutSK hynix is supplying the
        majority of HBM used in Nvidia's AI GPUs. In 2024, the company began
        mass production of HBM3E, with performance reaching 1.2 TB/s bandwidth
        per stack, optimized for Nvidia's H200 and upcoming B100 GPUs. SK hynix
        is investing heavily in additional HBM fabs in South Korea, with plans
        to quadruple capacity by 2028 to meet AI demand.

    --  Micron Technology: Expanding U.S. FootprintMicron announced shipments of
        its HBM3E in 2024, also validated for Nvidia's H200 GPUs. The company is
        building a new HBM fab in Idaho with U.S. CHIPS Act support, aiming to
        secure domestic supply of advanced memory for AI data centers.

    --  Samsung Electronics: Betting on HBM4Samsung is accelerating development
        of HBM4, targeting production by 2026, with advanced packaging solutions
        such as hybrid bonding. In 2025, Samsung announced a new partnership
        with AMD to integrate next-gen HBM into AI-optimized GPUs.

    --  Nvidia, AMD, and AI Infrastructure PlayersNvidia's record-breaking GPU
        sales in 2024-2025 were constrained by HBM supply, underlining the
        technology's critical role. AMD's MI300 accelerators, launched with
        HBM3, highlight the growing competition in AI compute. Cloud giants like
        Microsoft, Amazon, and Google are pushing suppliers to guarantee
        long-term HBM supply for their hyperscale AI data centers.

Emerging Trends: Efficiency, Packaging, and AI-Driven Demand

    --  Efficiency First: Training frontier AI models can cost tens of millions
        in electricity. HBM reduces energy use per bit transferred, making it
        vital to control data center operating costs.
    --  Advanced Packaging: Integration with 2.5D and 3D packaging technologies
        (such as TSMC's CoWoS and Intel's Foveros) is allowing HBM to scale with
        cutting-edge GPUs and AI accelerators.
    --  AI Compute Explosion: Each Nvidia H200 GPU requires over 140 GB of
        HBM3E, meaning every hyperscale deployment consumes thousands of HBM
        stacks. This dynamic has caused a global supply crunch in 2024-2025,
        with lead times stretching beyond a year.
    --  Regionalization of Supply: Governments in the U.S., South Korea, and
        Japan are investing billions in domestic semiconductor capacity to avoid
        overdependence on single suppliers, making HBM a geopolitical priority.

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Regional Highlights

North America

    --  Driven by AI hyperscaler investments, the U.S. is strengthening domestic
        HBM manufacturing. Micron's Idaho fab and Nvidia's deep reliance on SK
        hynix illustrate the U.S.'s dual strategy of building local capacity
        while securing global supply chains.

Asia-Pacific

    --  South Korea (SK hynix, Samsung) remains the global center of HBM
        production.
    --  Taiwan (TSMC) plays a crucial role in packaging, with demand for its
        CoWoS technology soaring.
    --  China is pushing for self-sufficiency, with local players like CXMT
        working on early-stage HBM R&D.

Europe

    --  European Union initiatives like the EU Chips Act are encouraging memory
        and advanced packaging R&D. Partnerships with ASML and local HPC
        projects (example: EuroHPC supercomputers) are opening a niche for HBM
        adoption in scientific computing and automotive AI.

Conclusion

The global HBM Market is no longer niche; it is becoming the backbone of the AI economy. With AI data centers projected to consume up to 12% of U.S. power and 4% of China's grid capacity by 2030, efficient memory like HBM is critical to sustaining growth. Companies such as SK hynix, Micron, and Samsung that control HBM capacity are now at the centers of the AI race, while Nvidia, AMD, and hyperscale's drive demand. As AI models double in size every 6-12 months, the trajectory of the HBM market will define the pace of AI innovation itself.

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Why Choose this Global High-Bandwidth Memory Report

Industry & Regulatory Insights: Coverage of major capacity expansions (Micron Idaho fab, SK hynix Korea expansions, etc.), geopolitical implications of HBM supply, and semiconductor policy drivers (U.S. CHIPS Act, EU Chips Act, South Korea subsidies, among others).

Innovation Spotlight: Next-gen HBM3E and HBM4, hybrid bonding, advanced packaging, and energy efficiency breakthroughs.

Geopolitical & Regional Analysis: Region and country-specific insights are covered. Report provides insights on North America's demand-driven scale, Asia-Pacific's production dominance, and Europe's push via HPC and automotive AI.

Actionable Strategies: Guidance for hyperscalers, OEMs, and investors on navigating HBM supply shortages, diversifying vendors, and aligning with frontier AI compute requirements.

Expert Insights: Perspectives on how AI-driven demand, packaging innovations, and supply chain concentration will shape HBM pricing, availability, and long-term market trajectory.

Stay ahead in the rapidly evolving AI hardware landscape, where memory is the bottleneck and HBM is the key to unlocking scalable intelligence.

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About DataM Intelligence

DataM Intelligence is a renowned provider of market research, delivering deep insights through pricing analysis, market share breakdowns, and competitive intelligence. The company specializes in strategic reports that guide businesses in high-growth sectors such as nutraceuticals and AI-driven health innovations.

To find out more, visit https://www.datamintelligence.com or follow us on Twitter, LinkedIn and Facebook.

Contact:
Sai Kiran
DataM Intelligence 4market Research LLP
Ground floor, DSL Abacus IT Park, Industrial Development Area
Uppal, Hyderabad, Telangana 500039
USA: +1 877-441-4866
Email: Sai.k@datamintelligence.com
Content Source: https://www.datamintelligence.com/research-report/high-bandwidth-memory-hbm-market
Visit Our Website: https://www.datamintelligence.com/

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View original content:https://www.prnewswire.com/news-releases/investor-insight-hbm-market-poised-for-26-10-cagr-reaching-usd-22-57-billion-by-2034--datam-intelligence-302555114.html

SOURCE DataM Intelligence 4 Market Research LLP



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