CoreFlow Unveils NEW 310 mm × 310 mm Vacuum Stage to Solve Major Warpage Challenges in CoPoS Panel-Level Packaging
Thursday, January 22, 2026
Engineered for precise, clamp-free flattening of highly warped glass substrates and seamless integration with existing fab metrology, lithography, and inspection systems
DALIAT-EL CARMEL, Israel, Dec. 16, 2025 /PRNewswire/ -- CoreFlow Ltd., a global provider of high-accuracy aerodynamic handling solutions for the semiconductor industry, today announced its next-generation Vacuum Stage for warped panel handling and flattening, designed for advanced CoPoS (Chip-on-Panel-on-310 mm × 310 mm substrate) packaging processes.
CoPoS substrates provide up to 81% more usable area compared to traditional 300 mm wafers, supporting higher device density and improved manufacturing efficiency for advanced AI-driven applications.
Derived from CoreFlow's fab-proven vacuum chucks currently used in 300mm wafers CoPoW process flows, the new 310 mm × 310 mm stage is designed to support next-generation CoPoS panel-level packaging requirements.
Industry Leadership Perspective
"Substrate warpage has become one of the industry's most critical manufacturing challenges," said Alon Segal, CEO of CoreFlow. "Building on our fab-proven experience with silicon wafers and glass substrates, the new 310 mm × 310 mm PLP vacuum stage integrates advanced aeromechanical design for accurate, clamp-free flattening. With interfaces compatible with standard fab utilities, the stage supports efficient integration into existing metrology, lithography, and inspection systems for advanced CoPoS panel-level packaging."
The new 310 mm × 310 mm stage is now available for order in Selective Vacuum or GripJet configurations, with optional surface finishing, ESD coating, and lift-pin assemblies. Customer-specific modifications are supported, with typical delivery lead times of 8-12 weeks.
About CoreFlow Ltd.
CoreFlow Ltd. (www.coreflow.com) is an leading developer and manufacturer of advanced substrate-handling systems for the semiconductor, FPD & Solar industries. Founded in 1999, CoreFlow has been at the forefront of aeromechanical innovation, with patented handling technologies deployed globally. The company's headquarters and R&D center are located in Daliat-El Carmel, Mt. Carmel, Israel, with manufacturing, sales, and customer-support operations in Korea, Taiwan, Japan, and China.
For more information or to schedule a technical briefing, please contact Sales@coreflow.com or solutions@coreflow.com or our local distributors.
Media & Sales Contacts:
-- Mr. Alon Kapel, VP BD, Sales & Marketing, CoreFlow Ltd.
alon_k@coreflow.com
-- Mr. Gaspard Hsieh, Asea Technical support manager.
gaspard_h@coreflow.com
Photo - https://mma.prnewswire.com/media/2846840/CoreFlow_Selective_Vacuum.jpg
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SOURCE CoreFlow Ltd
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